4-Layer Compact PCB Layout from Schematic — EasyEDA Expert Needed

I am the technical founder of a hardware startup looking for an experienced PCB layout engineer to complete the physical routing of a dense, mixed-signal wearable device. I have already fully architected the circuit, selected the components, and completed 100% of the schematic. I need a professional to handle the component placement and 4-layer routing from scratch according to strict RF and mechanical constraints. Project Overview: Software: EasyEDA (Work must be completed natively by joining my EasyEDA team workspace). Board Shape: Perfect circle, 44.8mm diameter (22.4mm radius). Layer Stackup: 4-Layer (Top Signal, Inner1 GND, Inner2 Power, Bottom Signal). Core Components: nRF9161 (Cellular IoT), ESP32-S3, SX1262 (LoRa), BQ24040 (Charging), MAX30102 (Pulse Oximeter), MPU6050 (IMU), GSR Sensors. Strict Mechanical & Routing Constraints: IMU Placement (Center): The MPU6050 must be positioned as close to the exact physical center of the circular board as possible to ensure mathematically accurate motion and rotation tracking. Sensor Placement (Bottom Layer): The MAX30102 and the Galvanic Skin Response (GSR) contact pads must be strategically placed to maintain flush, consistent physical contact with the user's skin through our custom enclosure. RF Keep-Out Zones: There must be absolutely no copper, traces, or components placed underneath the ESP32-S3 Wi-Fi antenna, the SX1262 LoRa antenna, or the nRF9161 antenna paths. Thermal/RF Grounding: You must place a 0.3mm via grid (assigned to the GND net) directly inside the center Exposed Pads (EPAD) of the RF components to connect them to the solid Inner1 ground plane. RF Trace Impedance: The RF traces must be kept as short as physically possible, impedance-matched, and routed cleanly. Required Final Deliverables: Source Files: Left intact in the shared EasyEDA project. Gerber Files: .zip format for JLCPCB. BOM (Bill of Materials): Must include the exact LCSC Part Numbers (C-parts) for all components for turnkey assembly. Pick & Place / CPL File: .csv format. I will provide the complete schematic upon hiring. If you have experience with compact wearables, RF routing, and strict DRC management, please reply with your estimated timeline, a brief mention of a similar compact/RF board you have routed, and a quick sentence on how you verify your RF keep-out zones.