Thermal Camera Daughter Board Re-design

Project Overview We are seeking an experienced freelance PCB Design Engineer to redesign an existing USB thermal camera daughterboard for improved electromagnetic compatibility (EMC)—specifically targeting reduced emissions and enhanced immunity. You will be provided with our working schematic files, current PCB layout, and functional sensor code. This is a fast-tracked project requiring immediate availability to take the board from layout optimization through prototyping, compliance testing, and low-rate initial production (LRIP). Key Responsibilities PCB Layout & EMC Optimization: Redesign board layer stackup, grounding strategies, decoupling networks, and high-speed/analog trace routing to minimize radiated/conducted emissions and maximize noise immunity. Standards Alignment: Design specifically to pass relevant IEC/CISPR EMC standards (e.g., IEC 61000-4 series for ESD, surge, and RF immunity; CISPR 32/35 for emissions). Prototyping & DFM: Generate full manufacturing deliverables (Gerber files, BOM, Pick & Place, fabrication drawings) and coordinate quick-turn prototype builds. Production Handoff: Validate prototype hardware and oversee the handoff to contract manufacturers for low-rate volume runs. Required Qualifications EMC/EMI Expertise: Extensive, practical experience solving signal integrity, ESD, and EMI/EMC challenges on high-speed USB and image sensor PCBs. Standards Familiarity: Deep working knowledge of IEC testing frameworks and mitigation strategies at the board level. Design & DFM: Mastery of major ECAD software (e.g., Altium, KiCAD, or Cadence) along with proven Design for Manufacturing / Assembly practices. Speed & Delivery: Track record of fast execution and taking designs directly into low-rate production.