Custom PCB Design

Project Brief: Custom Carrier PCB for Saeed Studio XIAO ESP32-C3 I need a compact, production-ready, 2-layer carrier PCB designed around the Saeed Studio XIAO ESP32-C3 module. Mechanical & Mounting Constraints Form Factor: Ultra-compact optimized for a cylindrical enclosure MCU Mounting: The XIAO module must be surface-mounted flat onto the carrier board utilizing its native castellated pads (no plastic pin headers). Electrical Architecture & Pin Map Power Entry: USB-C VBUS routes directly to the XIAO Vin (5V) pin. Dual independent 5.1 k-ohm SMD pull-down resistors must be tied from CC1 and CC2 to GND to support smart C-to-C charging. Main System Switch: Pins to connect to external switch that controls power to the board Battery Sensing (Pin A0 / GPIO 2): A 10 k-ohm resistor divider network reads battery capacity. Indicator LEDs: System Power LED: Hardwired to VCC after switch  via a 330 ohm inline resistor (lights up automatically when switched on). Charging LED (Red): Routed from XIAO Pin D8 (GPIO 20) via a 330 ohm inline resistor to terminal pads. Full LED (Green): Routed from XIAO Pin D9 (GPIO 21) via a 330 ohm inline resistor to terminal pads. Peripherals Layout: Provide clearly labeled solder pads / compact JST headers for: MAX4466 Microphone board (VCC, GND, OUT to XIAO Pin A1 / GPIO 3) Momentary push-button (GND to XIAO Pin A2 / GPIO 4; relies on internal MCU pull-up) Required Deliverables Native design files (Native EasyEDA or KiCad format preferred). Production-ready manufacturing package (Gerber files, Drill files). Formatted BOM (Bill of Materials) specifying 0805 package sizes for passive components. Component Placement List (CPL / Centroid file) for automated SMT factory assembly.