Drone EO/IR Payload Project: Building a NextVision-class EO/IR camera payload for defence UAVs

Job Title: Senior Embedded Hardware & Vision Engineer — Drone EO/IR Payload Project: Building a NextVision-class EO/IR camera payload for defence UAVs (Indian market) Must Have PCB design in Altium or KiCad — 6 to 10 layer, high-speed, impedance controlled MIPI CSI-2 sensor bring-up on Linux (V4L2 drivers) Experience with Sony IMX or FLIR Boson/Lepton integration NVIDIA Jetson Orin or equivalent SoC — board bring-up, BSP customization Basic ISP pipeline — exposure, white balance, noise reduction, HDR H.264/H.265 hardware encode, RTSP streaming via GStreamer Power electronics — multi-rail DC-DC design from 12V or 28V UAV bus EMI/EMC layout discipline Good to Have Gimbal controller electronics — FOC/BLDC, SimpleBGC or custom TensorRT or OpenCV deployment on edge MISB ST 0601 metadata embedding Experience with defence or aerospace payloads Deliverables Expected Sensor interface PCB schematic and layout files Working video stream from EO and/or IR sensor on Jetson H.265 encoded RTSP output with stable latency under 150ms Basic ISP tuning for outdoor UAV lighting conditions Experience Required: 8+ years in embedded systems with at least 2–3 years specifically in camera/vision hardware Engagement: Freelance, milestone-based, long-term if fit is right