LED PCB Thermal & DFM Optimization

LED PCB Thermal & DFM Optimization – Keep Existing Layout (50 LEDs). Maintain the exact current LED placement and distribution without moving components. Ensure thermal efficiency and reliability while adhering to design constraints. Key requirements: Keep the exact current LED placement and distribution (do not move components). Design proper thermal vias and copper pours (especially on Bottom layer) to keep LED temperature below 50°C. Fix all DFM/DFA issues: acid traps, via-to-pad clearance (minimum 0.5 mm from LED pads), and other manufacturing defects. Optimize traces, vias, and copper areas for better electrical and thermal performance. Ensure the design follows IPC standards and is ready for mass production. Deliver updated Gerber files (and ideally a short thermal justification or simulation recommendations). Current situation (from engineer review): No thermal vias currently exist. Thermal copper on Top layer is acceptable, but needs to be mirrored/improved on Bottom. Some acid traps and vias too close to LED pads. Electrical review was limited because schematic was not provided. What you will receive: Current Gerber files Schematic (PDF) LED specifications and target operating current Target: Max LED temperature ≤ 50°C Ideal freelancer: Experienced in high-density LED PCBs, thermal via design, and DFM for LED lighting. applications. Experience with thermal simulation (or strong knowledge of thermal via/pour best practices) is a big plus.