Multiphysics Simulation (CFD/Thermal) for AI Bakery Mixer with Temperature-Controlled Bowl

Korean fluency required. Top Rated Plus Badge prefered Price between $500-$1000 ausd (Can be negotiated) I am seeking an experienced Mechanical/Simulation Engineer to validate the thermal performance of a patented AI-integrated bakery mixer. The project focuses on a "Temperature-Controlled Bowl" designed for professional baking. Objective: Perform a 3D Multiphysics simulation to test the feasibility of maintaining precise dough temperatures during the mixing process. Key Responsibilities: • Model the Heat Transfer between the temperature-controlled bowl (heating/cooling elements) and high-viscosity dough.Conduct CFD analysis considering Non-Newtonian fluid properties (bread/cake dough).Analyze the impact of friction heat generated by the mixing hook on the overall dough temperature.Provide a detailed report on thermal distribution and time-to-target temperature.Requirements: • Proficiency in Ansys Fluent, COMSOL Multiphysics, or similar high-end simulation tools.Experience with kitchen appliance design or food processing simulation is a plus.Ability to deliver production-ready 3D CAD analysis (STEP/IGS). [URGENT] 3D CAE Thermal & Multiphysics Simulation for Innovative Commercial Mixer Bowl * DEADLINE: This is a short-term project. The final simulation report must be delivered within 7 to 10 days. * BUDGET: $700 USD (Fixed-price). 1. Project Overview We need a professional 3D Multiphysics (Thermal + Structural) simulation for a newly patented temperature-controlled commercial mixer bowl. The goal is to prove the cooling efficiency of our unique 3-layer structure against severe friction heat generated by heavy dough mixing. 2. Hardware Structure (Crucial for 3D Modeling) The mixer bowl consists of a 3-layer sandwich structure: - Inner Layer: 1.5mm Aluminum - Middle Layer: 2.0mm ~ 3.0mm Peltier Rope Net (Acts as an impact-absorbing mesh & active thermal transfer layer) - Outer Layer: 2.0mm Aluminum 3. Load & Fluid Conditions - Dough Type: Highly Enriched Sweet Dough (Non-Newtonian fluid, highly viscous, Viscoelastic behavior). - Total Dough Weight: 20kg (Extreme heavy load). 4. Thermal Simulation Goals - Worst-Case Scenario: During heavy mixing without cooling, the friction causes the dough temperature to rise to 35°C (which destroys gluten). - Target Validation: Prove that by activating the Peltier cooling layer, the system can aggressively suppress the heat and strictly maintain the dough temperature below 30°C. 5. Required Deliverables - Comprehensive simulation report (PDF) including visual temperature distribution maps (heatmaps). - Source files (Ansys, Solidworks, or equivalent). - Up to 2 minor revisions if the initial cooling targets require slight parameter adjustments.