RF PCB Design: SDR-Based Private LTE Bridge: Schematic to JLCPCB-Ready

PCB design: compact SDR-based private LTE bridge — schematic, layout, and JLCPCB-ready production package (full design spec provided) We are seeking an expert in schematic capture and RF PCB layout for a compact SDR-based private LTE bridge board. Functionally, the board bridges a wired Ethernet (or Wi-Fi) backhaul to a very short-range private LTE cell (less than 5 m) serving a single client device. The design is fully specified at block level — we will provide the block diagram, functional BOM (open to your improvements), RF level plan, and layout notes. Your job is to take it from specification to orderable hardware. The scope covers complete schematics and PCB layout for a 60 × 50 mm, 6-layer controlled-impedance board comprising an RPi CM4, a Zynq/AD9363 SDR subsystem, on-PCB trace antennas with DNP u.FL and SAW variants, and a 9–36 V automotive power input. Deliverables are threefold. First, native design files — KiCad preferred, Altium acceptable. Second, a complete JLCPCB-uploadable production package: Gerbers targeting a standard JLCPCB 6-layer impedance-controlled stackup, a BOM with LCSC part numbers (C-numbers), and a pick-and-place/CPL file — such that we can upload, pass JLCPCB's DFM and assembly checks, and order with no further engineering. Third, component engineering: parts matched to JLCPCB/LCSC assembly stock where available, with key parts outside their catalog (SoC, RF transceiver, compute module, TCXO) matched to current authorized-distributor stock and flagged for JLCPCB consigned/global-parts handling, including at least one proposed alternate per critical part, with availability and pricing verified at qty 100. Required: a strong circuit design and EE background, RF layout experience with SDR transceivers and antenna feed/matching networks, and prior boards manufactured through JLCPCB assembly or an equivalent turnkey fab.