Radar sensor design

We are looking for an experienced Hardware/PCB Designer and Firmware Engineer to help us build a two-board system featuring an advanced RF/radar sensor and a wireless host microcontroller. The ideal candidate must have experience with dense BGA packages, high-frequency design constraints, and clean power delivery. We have structured the project into 3 clear milestones: Project Milestones: Milestone 1: Sensor Bring-Up (Phase 1 Breakout) Design a "breakout" style PCB for the core sensor chip, ensuring provision and access to all internal ports for testing. Coordinate PCB fabrication and assembly, including BOM finalization and material procurement. Assist with initial firmware deployment and baseline sensor calibration. Milestone 2: Host MCU & Power Board Design a custom microcontroller product board featuring board-to-board connectors to interface with the Phase 1 sensor board. Integrate a complete Battery Management System (BMS) including battery protection, charge/discharge circuits, and an available percentage indicator. Integrate peripherals: Buzzer connector, RGB LED, and an 8x8 LED dot matrix. Coordinate PCB printing, BOM, and assembly for this board. Assist with firmware deployment and implement an OTA (Over-The-Air) auto-update architecture via a mobile app. Perform comprehensive sensor calibration, optimizing for both accurate detection and edge power consumption. Milestone 3: Final Integration & Enclosure Fine-tune the Milestone 1 sensor board design, stripping away unused ports to optimize for the final commercial form factor. Integrate both boards into one. Finalize all BOMs and coordinate the final PCB printing for both boards. Design a custom enclosure (must account for RF/sensor material transparency). Conduct final detection testing inside the enclosure and perform final sensor calibration. Required Skills & Experience: High-Density Interconnect (HDI) and dense BGA escape routing (0.5mm pitch or smaller). Proven track record of running strict Design Rule Checks (DRC) and actively coordinating with fab houses to ensure manufacturability. Strong background in Power Delivery Networks (PDN) for noise-sensitive chips. Experience with wireless MCU firmware deployment and mobile OTA updates. Mechanical/CAD design for enclosures.